Sigrity Signal and Power Integrity
Powerful signal integrity and PDN analysis and interconnect modeling for PCB and IC package designs
Fast and accurate electrical analysis of full IC packages or PCBs
Introducing Sigrity Signal and Power Integrity by Cadence. This advanced solution addresses power integrity (PI) and signal integrity (SI) challenges in complex PCB designs. With accurate system-level analysis for power integrity and seamless integration with Allegro PCB design tools, it enables efficient design processes. The power-aware SI tools ensure signoff-level accuracy by considering both signals and power/ground networks. Achieve optimal signal performance, minimize issues, and accelerate time-to-market with Sigrity Signal and Power Integrity.
Sigrity Aurora
Introducing Cadence Sigrity Aurora, the ultimate solution for signal and power integrity (SI/PI) analysis in PCB designs. With seamless integration into the Allegro PCB design environment, Aurora bridges the gap between design and analysis, providing quick and accurate results throughout the design process.
Key Benefits:
- In-design SI/PI analysis: Identify and address SI problems early on, reducing design iterations and time-to-market.
- Tight integration with Allegro: Seamlessly utilize Sigrity analysis engines within the Allegro implementation design canvas for efficient analysis.
- Quick screening without SI models: Perform initial design screening for SI issues without the need for complex SI models.
- What-if topology simulation: Explore different circuit topologies using the modern Allegro system capture canvas for accurate design constraint setting.
- Faster time to design success: Accelerate the design process and lower end product costs with efficient SI/PI analysis.
- Constraint-driven flow: Enable in-design SI/PI analysis within a constraint-driven design flow for optimized design outcomes
Sigrity Power SI
Sigrity Power SI is a powerful solution for analyzing power integrity (PI) and signal integrity (SI) in PCB designs. It provides comprehensive analysis and simulation capabilities to ensure optimal performance and reliability of power delivery networks.
- Accurate Analysis: Sigrity Power SI provides precise power and signal integrity analysis.
- Integrated Environment: Seamlessly integrates with popular PCB design tools like Cadence Allegro.
- "What-if" Simulations: Explore design scenarios and evaluate their impact on integrity.
- Fast and Accurate: Efficient analysis with advanced algorithms and simulation techniques.
- Design Optimization: Assists in optimizing power and signal integrity for better performance.
- Early Issue Detection: Detect potential SI/PI issues early on, reducing design iterations.
- Design Collaboration: Facilitates collaboration and sharing of analysis results between teams.
- Industry Standards Compliance: Ensures designs meet industry standards and guidelines.
Thermal Solvers
The thermal analysis of ICs and electronic systems is made more complex by interconnected electrical and thermal effects. IC-centric factors (process technology, switching frequency, power grid geometries), package and PCB factors (materials, component placement, conductor geometries), and system factors (enclosure spacing, conduction, and air flow) must all be accounted for. Switching between system operating modes such as on, standby, low power, and sleep can result in unexpected transients, further complicating the analysis.
Celsius PowerDC – Ensure reliable power delivery
Celsius PowerDC is a powerful technology by Cadence designed to ensure reliable power delivery in IC package and PCB designs. With its efficient DC analysis and electrical/thermal co-simulation capabilities, PowerDC enables accurate signoff and minimizes the risk of field failures. By quickly identifying excessive IR drop, areas of excess current density, and thermal hotspots, PowerDC helps reduce costs, prevent delays, and enhance the overall reliability of your power delivery system.
Key Features:
- Thermal-Only Flow: PowerDC offers a thermal-only flow, making it suitable for thermal analysis and ensuring efficient power delivery.
- CFD Ready: The technology is ready for computational fluid dynamics (CFD) analysis, enabling comprehensive assessment and optimization of thermal performance.
- Ensures Reliable Power Delivery: PowerDC identifies potential issues such as excessive IR drop and thermal hotspots, allowing you to address them and achieve reliable power delivery.
- Lowers Costs and Reduces Delays: By detecting design weaknesses and potential failures early on, PowerDC helps minimize costly iterations and delays in the product development cycle.
- Conclusive IR Drop Analysis: The technology provides detailed IR drop analysis for both IC packages and PCBs, ensuring voltage stability and reliability.
- Easy Workflow Deployment: PowerDC offers an easy-to-deploy workflow that is suitable for both occasional users and experts, making it accessible to a wide range of design teams.
Celsius EC Solver
Electronics cooling software for optimizing the thermal efficiency of complete systems. Description: Celsius PowerDC is a cutting-edge technology developed by Cadence to provide efficient DC analysis for signoff of IC package and PCB designs. It offers comprehensive electrical and thermal co-simulation capabilities to ensure reliable power delivery, lower costs, reduce delays, and prevent field failures. With Celsius PowerDC, you can achieve conclusive IR drop analysis, identify potential thermal hotspots, and optimize your designs for maximum performance and reliability.
Key Features:
- Thermal-Only Flow: Utilize a thermal-only flow to perform accurate and detailed thermal analysis, enabling you to address potential thermal issues proactively.
- Comprehensive IR Drop Analysis: Identify excessive voltage drops across the package and board, allowing you to optimize power distribution and minimize voltage fluctuations.
- Automated DC Simulations: Streamline the setup of DC simulations using PowerTree data captured during the schematic design stage, saving time and effort.
- Failure Point Detection: Pinpoint difficult-to-locate resistive routing neck-downs and identify critical failure points, enabling you to make informed design decisions.
- Multi-Structure Design Support: Analyze complex multi-structure PCB and package designs, including stacked die and multiple boards, to ensure power integrity across the system.
- Visualization and Analysis Options: Explore "what-if" scenarios with a unique block-diagram results view and a range of visualization options, empowering you to optimize your design for better performance.
- Easy-to-Use Workflow: Enjoy an intuitive and user-friendly workflow that suits both occasional users and experts, facilitating efficient analysis and design iteration.
- Integration with Leading Design Tools: Seamlessly integrate Celsius PowerDC with popular design tools like Allegro, Mentor, Zuken, and Altium, ensuring compatibility and flexibility in your design flow.
- Highly Accurate Analysis: Benefit from patented automation and advanced algorithms that deliver high accuracy, even for complex designs with multiple voltage domains and intricate plane structures.
- PowerTree Integration: Visualize and analyze the power portion of your schematics using PowerTree data, allowing you to make informed component selection decisions during pre-layout simulation.
Electromagnetic Solutions | EM Solvers
Cadence offers several types of EM field solvers that help you analyze EM coupling effects, signal coupling, EMI / EMC, and simultaneous switching noise (SSN). Whether your design challenge is developing a chip, package, PCB, or the complete subsystem, Cadence offers the right technology to address your EM modeling challenge quickly and efficiently.
Clarity 3D Solver - True 3D electromagnetic field solver for PCB and IC package design
Cadence Clarity 3D Solver is a state-of-the-art 3D electromagnetic (EM) simulation software tool designed for critical interconnects in PCBs, IC packages, and SoIC designs. It offers true 3D analysis, ensuring accurate and reliable results for complex EM challenges in applications such as 5G, automotive, high-performance computing (HPC), and machine learning.
Key Features:
- High Speed and Accuracy: Up to 10X faster simulations while maintaining gold-standard accuracy.
- True 3D Analysis: Avoids errors with accurate analysis of complex structures.
- Distributed Computing: Utilizes hundreds of CPUs for efficient parallel processing.
- Seamless Integration: Easily reads design data and integrates with Cadence implementation platforms.
- Cost Savings with Cloud Computing: Optimize resources and reduce expenses by utilizing cloud infrastructure.
- Complete Design Flow: Empowers reliable and competitive product development.
- Enhanced Usability: Accurate results for experts and non-experts with automatic resource matching.
- Breakthrough Parallelization: Flexible budgeting for optimal computer configurations.
- Design Platform Integration: Seamless integration with popular design platforms.
- Model EM Interface: Combine mechanical structures and model electromagnetic interfaces.
Clarity 3D Transient Solver - System-level EM solver with speed, capacity, and test-measurement accuracy
The Clarity 3D Transient Solver is a high-performance electromagnetic (EM) simulation tool. With its speed, capacity, and test-measurement accuracy, it addresses complex challenges in 5G, automotive, HPC, and ML applications. It offers up to 10X faster simulations, system-level analysis, easy data integration, breakthrough parallelization, and cost savings through cloud infrastructure. Designed for reliable product development, it empowers engineers to create competitive products on time and budget.
Features:
- High Speed and Capacity: Up to 10X faster simulations with increased capacity for system-level analysis.
- Distributed Computing: Utilizes hundreds of CPUs or multiple GPUs for efficient parallel processing.
- Seamless Integration: Easily reads design data and integrates with Cadence implementation platforms.
- Test-Measurement Accuracy: Delivers accurate results for electromagnetic compliance and other applications.
- Breakthrough Parallelization: Flexibility in budgeting for computer configurations required for 3D simulation.
- Cloud Computing Cost Savings: Optimize resources and reduce expenses by utilizing cloud infrastructure.
- Complete Design Flow: Empowers reliable and competitive product development.
- Flexibility for Engineers: Brings test-measurement 3D accuracy analysis to system-level compliance.
EMX Designer - Synthesis and optimization of passive components for high-frequency and high-speed IC designs
EMX Designer is a powerful tool for the synthesis and optimization of passive components in high-frequency and high-speed IC designs. It offers rapid and versatile component synthesis, surpassing traditional software tools in speed and flexibility. With the accuracy of the EMX 3D Planar Solver's electromagnetic modeling engine, EMX Designer quickly generates precise, DRC-clean parametric cells (PCells) for passive structures. Supporting a wide range of passive devices, such as inductors, transformers, and T-coils, EMX Designer is compatible with advanced nodes down to 3nm, ensuring seamless integration and efficient floorplan design.
Key Features:
- Blazing Fast Synthesis: Generate solutions in seconds based on user-defined constraints, allowing for maximum customization with highly flexible PCells.
- Dramatically Reduce Design Time: Synthesize optimal layouts of complex passive structures, saving valuable design time and improving productivity.
- Ultimate Design Flow Integration: Seamlessly integrate with Virtuoso Design Platform, enabling easy creation, updating, optimization, and plotting of required views.
- Unparalleled Accuracy: Create highly accurate and trustworthy electromagnetic models powered by the EMX 3D Planar Solver.
- The Most Flexible PCells: Access a complete library of passive device PCells, including inductors, transformers, T-coils, and more. Customize parameters such as tapering, aspect ratio, and via patterning for maximum flexibility.
- Foundry/PDK Agnostic: Supports any process node and metal stack option down to 3nm, ensuring compatibility across various technologies.
- DRC-Clean Structures: Generates structures that comply with design rule checks (DRC), protecting users from violations and ensuring adherence to fabrication requirements.
AWR AXIEM EM Solver - 3D planar EM analysis for S-parameter extraction and design verification
AWR AXIEM Analysis is a powerful 3D planar electromagnetic (EM) analysis software designed for accurate S-parameter extraction and design verification. It offers comprehensive capabilities to analyze and optimize passive structures, transmission lines, antennas, and arrays in RF PCBs, modules, LTCCs, MMICs, RFICs, and more. With its fast and accurate simulation engine, AXIEM provides designers with the necessary tools to characterize and optimize passive components, ensuring reliable performance and design success.
Key Features:
- Planar EM Analysis: AXIEM utilizes the method-of-moments (MoM) technique for efficient and accurate planar EM analysis of passive structures, transmission lines, and large planar antennas.
- Integrated Design Flow: Perform in-situ analysis and design verification to fully characterize RF/microwave devices and ensure successful designs.
- Fast Simulation: Benefit from the proprietary full-wave planar, open-boundary MoM technology, enabling fast-frequency sweeps and rapid analysis of complex structures.
- Accurate Results: Automatic adaptive meshing with advanced-hybrid meshing technology ensures reliable and accurate simulation results.
- Comprehensive Visualization: Visualize field distributions, perform post-processing, and explore optimization options with a range of visualization tools.
- Parametric Studies: Conduct optimization, tuning, and yield analysis through parametric studies, enabling efficient design exploration.
- High-Performance Computing (HPC): Take advantage of multi-core configurations and asynchronous simulation to accelerate simulation speed and improve productivity.
- Application Flexibility: AXIEM supports various applications, including passive components, MMIC/RFIC interconnects, and antennas and arrays, catering to a wide range of design needs.
